To: SIMCom customers using A7682E LTE module
Re: A7682E Module - PA & PCB Change, New Part Numbers
As you're aware from ongoing industry conditions, global electronic component supply has faced continuous pressure over the past two years - extended lead times and rising costs across PCBs, memory chips, PAs, crystals, and RLC components. This has impacted SIMCom's module supply chain as well.
To maintain stable supply and protect delivery schedules, SIMCom has qualified new suppliers for the PA and PCB used in the A7682E module. This has resulted in updated part numbers, detailed in the Product Change Notification (PCN-20260703-001, issued 3rd July 2026) :
- PA: Smarter Micro S5643-51 → Smarter Micro S5643-55
- PCB: BOMIN → RunTek
- Classification: Material change
- Effective Date: 3rd July 2026
As part of this change, the RF parameters in the module's embedded firmware have been adjusted accordingly. SIMCom has confirmed this will not affect core module function or performance, and there will be no negative impact on your end-application.
Based on our records, you are currently using the following A7682E part numbers, which map to the new versions below:
| Using HW PN | Using FW PN | New HW PN | New FW PN |
| S2-10CMN | Z31CH | S2-1306Q | N/A |
| S2-10AZK | Z329S | S2-1309M | N/A |
If required, we will be arranging new module samples reflecting these updated part numbers and will forward them to you as soon as they're available, so you can carry out qualification testing on your end before we transition future orders to the new versions.
Please let us know if you'd like us to expedite sample requests or if you have any questions in the meantime - we are happy to set up a call to walk through the change if useful.
Best regards,
Miyelani Kubayi
Technical Director
Otto Wireless Solutions (Pty) Ltd